In order to flourisch as a R&D service provider and system developer, one has to permanently add new methods and tools to the portfolio. Which innovations are relevant is best learnt in conversation with other professionals. Hence, we are glad to be the newest member of IMAPS Germany e.V.
IMAPS stands for dialogue in the form of panel discussions and round tables between colleagues from nearby. Originally emerged from thick-film and thin film circuits, the field of activity of IMAPS now includes the entire field of microelectronics, including packaging. Alongside traditional hybrid technologies it now includes Surface Mount Technology (SMT), Chip on Board (COB), application-specific circuits (ASIC), multi-chip modules (MCM), mechatronic components, microsystems, power hybrids, sensors and optoelectronic components.